|
|
Facilities
The NMDC occupies the first floor of the Optics building at UAHuntsville.
Primary laboratories include a variety of different clean room conditions
designed to meet the specific needs of processes performed within.
Photolithography and LPVCD processes reside in a class 1000 cleanroom.
Plating and dicing, which are often considered dirty processes, are
performed in unmonitored environments. Teaching labs, device testing,
wet chemistry and thin film deposition operate in a class 10,000 cleanroom.
Independent laboratory testing and polishing are performed in a class
100,000 environment. Particle count, temperature, and humidity are
monitored routinely.
Cleanroom Safety and Training Course - download
powerpoint presentation here!
Thin Film Deposition 
- Denton Discovery 18 Sputterer (RF, DC, pulsed DC)
- Thermal Evaporator
- 4 pocket e-beam evaporator
- 4" RF Sputtering tool
- Dry Thermal Oxidation Furnace
- Tystar 4 Tube LPCVD (located in Plasma Processing room)
- Poly Si, Doped Poly Si, Low Stress Nitride, TEOS Oxide
Etching 
- STS Multiplex ASE ICP RIE (Fluorine chemistry)
- PlasmaTherm 790 RIE Fluorine etcher
- Matrix 105 downstream plasma asher
- AMMT Single sided KOH etch tool
- Wet etch/strip of metals
- ABM contact aligner (Near UV, Mid UV, Deep UV)
- OAI contact aligner (Near UV)
Lithography
- AB-M LS 68 500W contact aligner (Near UV, Mid UV, Deep UV)
- OAI J500/VIS contact aligner (Near UV)
- Ultratech XLS i-line stepper
- LEO 1550 SEM with e-beam write and EDAX options
- Bransen 1510 ultrasonic cleaner
- Sonosys megasonic immersion paddle for thick resist development
- YES image reversal oven
- Thermolyne 12000 high temperature furnace
- 2 programmable vacuum ovens
- 3 convection ovens
- 2 SOLITEC - 5110-CD: Coat and Develop Systems
- Brewer Science Cee 200 coat and bake system
Metrology and Test Equipment 
- KLA - Tencor P-10 Profilometer
- Rudolf AutoEL IV ellipsometer
- Stress measurement tool
- Kulicke and Soffa 4123 Wire Bonder
- Micro Automation 1100 wafer dicing saw
- Micromanipulator 6200 probe station
- Newport Auto-align system
- PM Fiber Fusion Splicers
- Agilent Network Impedance Analyzer
Plating and Polishing
- Princeton Applied Research Verastat 3 with 2 Amp option
- Kocour Hull cell
- 4 in UAH developed plating tanks
- Materials: Ni, Permalloy, 45/55 NiFe, NiFeCo, Au, Cu, NiCu
- Engis Hyprez 15
 "
Lapping tool
Computing (Academic Use Only)
- Dual quad core Xeon chipset w/ 32 GB Ram, 750 MB Nvidia graphics
card
- Ansoft HFSS
- COMSOL Multiphysics
- Solidworks
- Autodesk
- Matlab
|
|
